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Spin casting: Page 1 of 2
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

Spin casting

The substrate is held by vacuum on a chuck. The material to be deposited is dissolved in a solvent. The solution is applied to the substrate, which is then rotated at high speed. The rotation spreads the solution evenly over the surface and also causes some of the solvent to evaporate leaving a thin film of material on the substrate. The substrate is usually baked immediately after spin casting to remove the remaining solvent in the film. The process is typically performed on one side of the substrate at a time.
Process
Photoresist coat with softbake (AZ 9260)
Photoresist coat with softbake (Shipley 1813)
Photoresist coat (Shipley 220)
Photoresist coat (Shipley 3612)
Backside protect (AZ P4400)
Backside protect (NR1-6000PY)
Hard baked resist coat (OiR 897 10i)
Cool grease bonding
Photoresist Spin Coat ACS200 (AZ 9245)
Protective coating for KOH etch (ProTEK)
Spin casting (Durimide 7520)
Spin casting (Durimide)
Spin casting Programmable Spinner
G-line BCB coat (BCB 4000)
G-line photoresist coat (AZ4000)
Resist bonding
Photoresist coat (495 PMMA 6 A in anisole)
Photoresist coat (950 PMMA 2 A in anisole)
Photoresist coat (950 PMMA 4 A in anisole)
Photoresist coat (950 PMMA 9 A in anisole)
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