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Photoresist coat (Shipley 220): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Photoresist coat (Shipley 220)
on front
100% HMDS prime
MaterialHMDS
MaterialShipley 220Thickness7 µm
Material Shipley 220
Resist thickness 7 µm
Wafer size
Wafer size
Comments:
  • The film is softbaked at 90 C for 25 min.