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Evaporation: Page 1 of 2
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

Evaporation

The substrate is placed in a high vacuum chamber at room temperature with a crucible containing the material to be deposited. A heating source is used to heat the crucible causing the material to evaporate and condense on all exposed cool surfaces of the vacuum chamber and substrate. The process is typically performed on one side of the substrate at a time. Typical sources of heating are: E-beam, Resistive heating, RF-inductive heating. In some systems the substrate can be heated during deposition to alter the composition/stress of the deposited material.
Process
Ebeam evaporation (CHA)
Gold Evaporation with Adhesion Layer
Platinum Evaporation with Adhesion Layer
Evaporation (Evatek -Batch dome)
Titanium Oxide (Ti3O5) E-beam Evaporation
Chromium E-beam evaporation
Copper E-beam evaporation
Gold E-beam evaporation
Titanium E-beam evaporation
E-beam metal evaporation (Temescal)
E-beam Evaporation (Au)
E-beam Evaporation (Cr)
E-beam Evaporation (Pt)
E-beam Evaporation (Ti)
Parylene C deposition
E-beam evaporation
Germanium E-beam evaporation
Nickel E-beam evaporation
E-beam evaporation
Evaporation
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