Ebeam evaporation (CHA): View

on front Ebeam evaporation (CHA)

Process characteristics:

Adhesion layer material

Adhesion layer thickness

If no adhesion layer will be used, enter 0 for this field.

0 .. 50 nm

Material

Perform sheet resistance measurement

One measurement per batch on a monitor wafer

Thickness

Allowed thickness ranges:
Ag: 0 .. 0.5um
Al: 0 .. 0.2um
Au: 0 .. 1um
Cr: 0 .. 0.5um
Ge: 0 .. 0.025um
Ni: 0 .. 1um
Si: 0 .. 0.050um
Pt: 0 .. 0.1um
Ti: 0 .. 0.1um

0 .. 1 µm

Wafer size

Comments:

Metrology includes only one measurement on a monitor wafer per batch.
Allowed thickness ranges: (please contact for thicker depositions)
Ag: 0 .. 0.5um
Al: 0 .. 0.2um
Au: 0 .. 1um
Cr: 0 .. 0.5um
Ge: 0 .. 0.025um
Ni: 0 .. 1um
Si: 0 .. 0.05um
Pt: 0 .. 0.1um
Ti: 0 .. 0.1um