Register
or
Sign in
Advantages
Capabilities
Company
Contact
About MEMS
Miscellaneous deposition: Page 1 of 3
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
10
20
50
100
per page
Process
Development #1 - LaNiO3 (LNO) Deposition
Development #2 - PZT on LaNiO3 (LNO)
PZT Development module
PZT on LaNiO3 (LNO) Deposition
Platinized silicon wafer (SiO2/TiOx/Pt)
Polyimide deposition and curing (Durimide)
Polyimide deposition, patterning and curing (Durimide 7520)
Parylene C deposition
Parylene N deposition
Parylene C deposition
Anti-stiction coating (Alkylhalosilanes)
ALD
Cool grease bonding
Photoresist Spray Coat
Spin casting (Durimide 7520)
Spin casting (Durimide)
Spin casting Programmable Spinner
Copper electroplating
Gold electroplating
Nickel electroplating (sulfamate)
Results Page:
1
2
3
