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Deposition: Page 1 of 16
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Development #1 - LaNiO3 (LNO) Deposition
Development #2 - PZT on LaNiO3 (LNO)
Dry oxidation
Ebeam evaporation (CHA)
PZT Development module
PZT on LaNiO3 (LNO) Deposition
Platinized silicon wafer (SiO2/TiOx/Pt)
Polyimide deposition and curing (Durimide)
Polyimide deposition, patterning and curing (Durimide 7520)
Silicon dioxide PECVD (PlasmaTherm 790)
Silicon dioxide PECVD (Unaxis VLR 700)
Silicon nitride PECVD (PlasmaTherm 790)
Silicon nitride PECVD (Unaxis VLR 700)
Sputter deposition (CVC)
Sputter deposition (Varian)
Wet oxidation
Aluminum DC-magnetron sputtering (high power)
Aluminum DC-magnetron sputtering (low power)
Aluminum/silicon/copper DC-magnetron sputtering (high power)
Aluminum/silicon/copper DC-magnetron sputtering (low power)
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