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Sputter deposition (Varian): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Sputter deposition (Varian)
Process characteristics:
Adhesion layer material
Adhesion layer material*
Adhesion layer thickness
If no adhesion layer will be used, enter 0 for this field.
Adhesion layer thickness*
If no adhesion layer will be used, enter 0 for this field. , must be 0 .. 50 nm
0 .. 50 nm
Material
Material*
Perform sheet resistance measurement
Perform sheet resistance measurement*
yes no
Thickness
Allowed thickness ranges:
Pt: 0 .. 0.35um
Ta: 0 .. 0.05um
Ti: 0 .. 0.05um
Thickness*
Allowed thickness ranges: Pt: 0 .. 0.35um Ta: 0 .. 0.05um Ti: 0 .. 0.05um, must be 0 .. 1 µm
0 .. 1 µm
Wafer size
Wafer size
Comments:
  • Allowed thickness ranges: (please contact for thicker depositions)
  • Pt: 0 .. 0.35um
  • Ta: 0 .. 0.05um
  • Ti: 0 .. 0.05um
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