| E-beam Lithography |
| Nickel LIGA (fully anchored structures) (PMMA) |
| Nickel LIGA (fully released structures) (PMMA) |
| Nickel LIGA (suspended structures) (PMMA) |
| Application Specific Integrated MEMS Exchange (ASIM-X) |
| Titanium/nickel DC-magnetron sputtering |
| Maskless photolithography (align/expose only) |
| Maskless photolithography (front-front align) (Rogers R/Flex 8080) |
| Maskless photolithography (front-front align) (Shipley 1827) |
| Maskless photolithography (front-front align) (Shipley 220) |
| Nanogetter packaging |
| Nickel LIGA (fully anchored structures) (Type 1 mold insert) |
| Nickel LIGA (fully anchored structures) (Type 2 mold insert) |
| aMEMS |
| 5X DUV photolithography |
| 5X DUV photolithography (with BARC) |
| Deep boron diffusion (Double-sided) |
| Deep boron diffusion (Single sided) |
| P-type polygermanium LPCVD |
| Poly-Silicon-Germanium LPCVD |
