Unique capabilities: Page 1 of 3

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
DUV Lithography
Deep boron diffusion
Hot Embossing
LIGA
Maskless lithography
Microwave bonding
Shape memory alloy deposition
Silicon-germanium processes
Supercritical dry
Xenon difluoride etch

Process
Nickel LIGA (fully anchored structures) (PMMA)
Nickel LIGA (fully released structures) (PMMA)
Nickel LIGA (suspended structures) (PMMA)
Application Specific Integrated MEMS Exchange (ASIM-X)
Titanium/nickel DC-magnetron sputtering
Maskless photolithography (align/expose only)
Maskless photolithography (front-front align) (Rogers R/Flex 8080)
Maskless photolithography (front-front align) (Shipley 1827)
Maskless photolithography (front-front align) (Shipley 220)
Nanogetter packaging
Nickel LIGA (fully anchored structures) (Type 1 mold insert)
Nickel LIGA (fully anchored structures) (Type 2 mold insert)
aMEMS
5X DUV photolithography
5X DUV photolithography (with BARC)
Deep boron diffusion (Double-sided)
Deep boron diffusion (Single sided)
P-type polygermanium LPCVD
Poly-Silicon-Germanium LPCVD
Undoped polygermanium LPCVD
Results Page: 1 2 3