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Supercritical dry: Page 1 of 1
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

Supercritical dry

The supercritical release system dries wafers or dies after wet processing (such as release) without any surface tension (thus preventing stiction). The supercritical CO2 release system uses liquid CO2 to displace methanol from the system chamber at pressure. The chamber is then heated past the CO2 supercritical point, and the pressure released. The supercritical CO2 has extremely low surface tension, and as a result does not pull structures down as it transitions from liquid to gas. It is also an excellent cleaning fluid as the supercritical state retains the ability of liquid CO2 to dissolve organic compounds and oils, while the lowered surface tension makes it easier for the fluid to penetrate complex geometries and small cracks.
Process