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Hot Embossing: Page 1 of 1
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

Hot Embossing

Hot embossing is essentially the stamping of a pattern into a polymer softened by raising the temperature of the polymer just above its glass transition temperature. The stamp used to define the pattern in the polymer may be made in a variety of ways including micromachining from silicon, LIGA, and machining using a CNC tool (for making large features). A wide variety of polymers have been successfully hot embossed with micron-scale (and below) size features, including polycarbonate and PMMA. This technique is used primarily for defining micro-channels and wells for fluidic devices. The benefits of this approach are the ability to take advantage of the wide range of properties of polymers, as well as the potential to economically mass produce parts with micron-scale features.
Process