|
|
| Process characteristics: |
| Cycle Time |
|
|---|
| Embossing Material |
|
|---|
| Stamp Material |
|
|---|
| Aspect ratio |
7 |
|---|
| Batch size |
1 |
|---|
| Contact force Force applied at contact point |
0 .. 200000 N |
|---|
| Min feature size |
1 µm |
|---|
| Sides processed |
either |
|---|
| Temperature |
23 .. 500 °C |
|---|
| Equipment |
Jenoptik Hex 03 |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
4 mm |
|---|
MEMS and Nanotechnology Exchange