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LIGA: Page 1 of 1
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

LIGA

LIGA stands for X-ray LIthography, Electroforming (German: Galvanoformung), and molding (German: Abformung). This technology allows us to define high aspect ratio structures in nickel. The process consists of exposing a sheet of PMMA bonded to a wafer using X-ray lithography. The PMMA is then developed and the exposed material is removed. Nickel is then electroplated up in the open areas of the PMMA. The nickel over-plate is removed by polishing, leaving high aspect ratio nickel parts. The PMMA is removed, and the nickel parts may remain anchored to the substrate or be released.
Process