Nickel LIGA (fully anchored structures) (Type 2 mold insert): View

Nickel LIGA (fully anchored structures) (Type 2 mold insert)

Process characteristics:

Nickel thickness

20 .. 500 µm

Aspect ratio

Batch size

Mold height uniformity

5 µm

Mold sidewall roughness

50 nm

Smallest feature size

20 µm

Wafer diameter(s)

List or range of wafer diameters the tool can accept

123.825 mm

Wafer thickness

List or range of wafer thicknesses the tool can accept

0.25 inch

Wafer size

Comments:

The layout will be reviewed by Mezzo Systems.
The effective pattern area is 3.5inch in diameter.
The wafer is provided by Mezzo Systems.
The standard aspect ratio for the mold inserts used in hot embossing is 7. Please contact Mezzo Systems for higher aspect ratios.
Defect criteria < 3 defects/inch2 at 5um size.
The estimated lead time is for this process 8-10 weeks.