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Hot Embossing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Hot Embossing
Process characteristics:
Embossing Material
Embossing Material
Aspect ratio 7
Batch size 1
Contact force
Force applied at contact point
0 .. 40000 N
Min feature size 20 µm
Sides processed either
Stamp Material nickel
Temperature 23 .. 300 °C
Equipment