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Hot embossing: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
   Contact mask lithography
   Maskless lithography
   Miscellaneous lithography
   Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
   DUV Lithography
   Deep boron diffusion
   Hot Embossing
   LIGA
   Maskless lithography
   Microwave bonding
   Shape memory alloy deposition
   Silicon-germanium processes
   Supercritical dry
   Xenon difluoride etch

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Hot embossing
Process characteristics:
Depth
Depth of embossing pattern.
Depth
Depth of embossing pattern.
unconstrained
Embossing Materials
Preferred embossing material (if known).
Embossing Materials
Preferred embossing material (if known).
Min feature size
Dimension of the smallest feature to be embossed.
Min feature size
Dimension of the smallest feature to be embossed.
unconstrained
Sides processed either
Equipment
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