aMEMS: View

aMEMS

Process characteristics:

Perform release etch

Release the structure layer by dry etch prior to final shipment

Substrate material

The substrate on which the aMEMS structural layer is bonded.
(currently there is only one high-res Si choice with 2000 ohm.cm)

Batch size 1

Design area

Active design area per chip site in a multi-user project runs

5950 um x 5600 um

Die count

Number of fabricated dies per chip site

Comments:

This is a SOI based two-mask process.
Please follow the design rules specified in section 2.3 of the design manual included below.
Please contact for custom run details.
To register interest in this process, please complete
this http://www.mems-exchange.org/survey/amems/new

Attachments

aMEMS Design Handbook v10.pdf (831.2 KB, application/pdf)
amems_1.png (23.3 KB, image/png): Cross-sectional view of thin layers. Film thicknesses are as follows: aluminum : 0.5um (Mask #2: STRUCTURE) silicon : 20um (Mask #2: STRUCTURE) Oxide: 1.6um (Mask #1: BRIDGE) Bond Layer: 20um
amems_3.png (119.5 KB, image/png): Process flow