The MEMS and Nanotechnology Exchange is pleased to announce the release of the aMEMS process module from the MEMS foundry at Rockwell Scientific. This versatile process module combines the benefits of SOI wafer processing with high aspect ratio single crystal silicon etching to provide a single process that can be used in many MEMS applications. This process provides complete GDS file-to-device fabrication. We believe this addition to the MEMS and Nanotechnology Exchange process catalog will provide an even larger set of capabilities to our customers for the implementation of their devices.

More information about this process and its availability can be found in the MEMS and Nanotechnology Exchange process catalog, including a Design Handbook explaining the process and how to submit a design based on this process (See: aMEMS Process) or by contacting the MEMS and Nanotechnology Exchange at 703-262-5368 or email us at engineering@mems-exchange.org.

As a special one time offer to allow our customers to test out this exciting new process capability, the MEMS and Nanotechnology Exchange in conjunction with the participating foundry will conduct a process run that will be made available to selected members of the domestic community at no cost (*). Parties interested in this opportunity will need to notify us of their interest by submitting the information in the form below by September 30, 2005. The MEMS and Nanotechnology Exchange will select up to four organizations to participate in this offer and will notify the selected parties in early October. Persons or groups submitting a process run under this opportunity will be required to set up a customer account with the MEMS and Nanotechnology Exchange and submit their designs no later than October 28, 2005.

Please fill out this form to request consideration for this free processing.

* 
Certain restrictions will apply to these no-cost process offerings. The term no-cost only refers to the actual MEMS or Nano processing work performed by the foundry. Customers will be required to pay for the cost for any special substrates, integrated circuits processes, shipping, and any additional services provided.
1)
Contact Information
Contact name
Phone number
Company
Street
City
State/province
Country
Postal/ZIP code
2)
Email


3)
Are you a DoD organization?

yesno

4)
Are you a DoD/DARPA contractor?

yesno

5)
Are you a MEMS Exchange customer?

yesno

6)
In what area of MEMS device development are you or your organization primarily involved?

e.g., inertial sensors for aerospace applications using MEMS device made using DRIE and integrating these MEMS devices with electronics


7)
Please state the reason for your interest in this module. What problems do you think that the process module(s) may solve?


8)
DARPA and the MEMS Exchange are very interested in having the customers of these process modules share any information about how well the process module worked for them, including any resultant data from experiments and testing derived from devices fabricated using these process modules. Would you be willing to share any such information or feedback about your experience with the process module(s) with DARPA and/or the MEMS Exchange?

yesno

9)
What kind of testing are you intending to perform?