Titanium/nickel DC-magnetron sputtering: View

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Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
DUV Lithography
Deep boron diffusion
Hot Embossing
LIGA
Maskless lithography
Microwave bonding
Shape memory alloy deposition
Silicon-germanium processes
Supercritical dry
Xenon difluoride etch

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front Titanium/nickel DC-magnetron sputtering

on front

1 Titanium/nickel DC-magnetron sputter

Material	titanium/nickel

on front

2 Stylus profilometer step measurement

Depth	100 µm

Process characteristics:

Thickness

Amount of material added to a wafer

0 .. 2 µm

Excluded materials

gold (category), copper

Material

titanium/nickel

Wafer size

Comments:

Film thickness measurements are performed by stylus profilometry. A separate, partially-masked substrate is loaded along with each wafer and is used to measure the thickness of the as-deposited film.

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.