Titanium/nickel DC-magnetron sputter: View

on front Titanium/nickel DC-magnetron sputter

Process characteristics:

Thickness

Amount of material added to a wafer

0 .. 2 µm

Ambient

Ambient to which substrate is exposed during processing

argon

Batch size

Deposition rate

Rate at which material is added to a wafer

1 µm/hour

Excluded materials

gold (category), copper

Material

titanium/nickel

Microstructure

martensite

Sides processed

either

Temperature

430 °C

Wafer size

Equipment

DVI Discovery-18

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

stainless steel

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 10000 µm

Comments:

TiNi (50:50)

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.