| PECVDPlasma enhanced chemical vapor deposition (PECVD) is performed in a
reactor at temperatures up to ~400 degC. The deposited film is a
product of a chemical reaction between the source gases supplied to
the reactor. A plasma is generated in the reactor to increase the
energy available for the chemical reaction at a given temperature. The
process is typically performed on one side of the substrate at a
time.
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