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Silicon nitride PECVD: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Silicon nitride PECVD
Materialsilicon nitrideRefractive index2.002Residual stress50 MPa
Thickness0.01 .. 5 µm
Process characteristics:
Are wafers metalized
Are wafers metalized*
yes no
Perform clean
Perform clean*
yes no
Thickness
Thickness*
must be 0.01 .. 3.25 µm
0.01 .. 3.25 µm
Material silicon nitride
Wafer size
Wafer size