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Polyimide deposition, patterning and curing (Durimide 7520): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
   Contact mask lithography
   Maskless lithography
   Miscellaneous lithography
   Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Polyimide deposition, patterning and curing (Durimide 7520)
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Curing temperature
Tube furnace: 300-400C.
Blue M Oven: 200-240C.
Curing temperature*
Tube furnace: 300-400C. Blue M Oven: 200-240C., must be 200 .. 400 °C
200 .. 400 °C
Curing time
Curing time*
must be 30 .. 240 min
30 .. 240 min
PI Curing tool
PI Curing tool*
Thickness
Cured thickness of material deposited.
Thickness*
Cured thickness of material deposited., must be 10 .. 40 µm
10 .. 40 µm
Material Durimide 7520
Wafer size
Wafer size
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