Furnace anneal (Nitrogen) |
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| Process characteristics: |
| Process duration |
|
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| Temperature |
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| Anneal ambient |
nitrogen |
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| Batch size |
50 |
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| Wafer size |
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| Equipment |
BTI Horizontal Tube Furnace |
| Equipment characteristics: |
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
quartz boat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
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MEMS and Nanotechnology Exchange