Parylene C deposition: View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front Parylene C deposition

1 Ultrasonic clean

2 Application of adhesion promoter (MEOPTS)

Material	97% 3-Methacryloxypropyltriethoxyline

3 Application of demoter

Material	Micro-90

4 Parylene C deposition

Material	Parylene C

on front

5 Optical surface profilometry

on front

6 Spectroscopic ellipsometry film thickness measurement

Refractive index	1 .. 4	Thickness	0.01 .. 5 µm

on front

7 Spectroscopic ellipsometry film thickness measurement

Refractive index	1 .. 4	Thickness	0.01 .. 5 µm

Process characteristics:

Apply adhesion demoter

Apply adhesion promoter

Clean type

Perform optical surface profilometry

Perform spectroscopic ellipsometry

Perform stylus profilometry

Thickness

Amount of material added to a wafer

1 .. 25 µm

Batch sizes

100 mm: 4, 50 mm: 6, 75 mm: 5

Material

Parylene C

Sides processed

both

Wafer size

Comments:

Parylene C is an inert, hydrophobic, optically clear biocompatible polymer coating material used in a wide variety of industries. Because it is deposited by vapor deposition, Parylene provides a conformal coating on virtually any substrate which is not achievable by other means. Its lubricity is close to that of Teflon but can be applied uniformly in much thinner coatings, ideal for MEMS and BioMEMS based applications. Parylene's pinhole free conformal coating protects coated substrates from moisture, chemicals, and electric charge. While Parylene is typically used to coat circuit boards or immobilize particles, it can also be removed from the original surface and used as a microstamp allowing MEMS patterns to be transferred reproducibly to polymers with various properties.
Parylene properties are available from the manufacturer at
http://www.scscookson.com/parylene/properties.htm
http://www.scscookson.com/downloads/coatspec.pdf
In single-sided depositions, another set of dummy wafers must be provided to cover the backside of the wafers.
Parylene can be patterned in oxygen plasma with a photoresist mask. (O2 15 sccm, RF Power=100W, Bias=470-500V)