on front Cool grease bonding |
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|
| Batch size |
1 |
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| Material |
AIT cool grease 7016 |
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| Sides processed |
either |
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| Thickness |
4 .. 6 µm |
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| Wafer size |
|
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| Equipment |
Headway Manual Spinner |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0 .. 75 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 2500 µm |
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| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, indium phosphide, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator |
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MEMS and Nanotechnology Exchange