Copper E-beam evaporation: View

on front Copper E-beam evaporation

Process characteristics:

Thickness

Thickness of material to be deposited.

0 .. 0.1 µm

Material

copper

Sides processed

either

Wafer size

Equipment

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

no-flat, 1-flat, 2-flat, notched

Wafer holder

Device that holds the wafers during processing.

mechanical clamp

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

0 .. 1500 µm