Germanium E-beam evaporation: View

on front Germanium E-beam evaporation

Process characteristics:

Thickness

Amount of material added to a wafer

0.01 .. 4000 Å

Material

germanium

Sides processed

either

Temperature

25 °C

Wafer size

Equipment

Equipment characteristics:

Batch sizes

100 mm: 8, 50 mm: 8, 75 mm: 8

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, no-flat, notched

Wafer holder

Device that holds the wafers during processing.

rotating orbital

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

gallium arsenide, glass (category), indium phosphide, Pyrex (Corning 7740), quartz (fused silica), silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm