E-beam evaporation: View

on front E-beam evaporation

Process characteristics:

Material

Material to be deposited.

Material

Material to be deposited.

Microstructure

Specify preferred microstructure of deposited film (if known).

Residual stress

Specify preferred residual stress in deposited film (if known). Positive values refer to tensile film stress.

unconstrained

Thickness

Thickness of film to be deposited.

unconstrained

Sides processed

either

Equipment

Comments:

The substrate is placed in a high vacuum chamber at room temperature with a crucible containing the material to be deposited. An electron beam is aimed at the material in the crucible causing it to evaporate and condense on all exposed cool surfaces on the vacuum chamber and substrate. The process is typically performed on one side of the substrate at a time.