on front E-beam metal evaporation (Temescal) |
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| Process characteristics: |
| Material |
|
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| Thickness Thickness of material to be deposited. |
|
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| Sides processed |
either |
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| Temperature |
22 °C |
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| Wafer size |
|
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| Equipment |
Temescal FCE 2700A Evaporator
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| Equipment characteristics: |
| Batch sizes |
150 mm: 15 |
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| MOS clean |
yes |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, fused silica, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 900 µm |
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MEMS and Nanotechnology Exchange