Protective coating for KOH etch (ProTEK) : View

on front Protective coating for KOH etch (ProTEK)

Batch size

Material

ProTEK B1-18

Sides processed

either

Temperature

205 °C

Thickness

0 .. 2 µm

Equipment

Equipment characteristics:

Piece dimension

Range of wafer piece dimensions the equipment can accept

1 .. 6 inch

Piece geometry

Geometry of wafer pieces the equipment can accept

circular, irregular, other, rectangular

Piece thickness

Range of wafer piece thickness the equipment can accept

200 .. 800 µm

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

gallium arsenide, glass (category), other, silicon

Comments:

The primer will be used to improve the adhesion of the main protective coating.
This step includes spin casting and bake of the protective coating. No additional curing is necessary.
The coats can be stripped with acetone or oxygen plasma.