logo
Register or Sign in

Photoresist coat (Shipley 3612): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
   Evaporation
   LPCVD
   Low-stress SiN deposition
   Miscellaneous deposition
   Oxidation
   PECVD
   Spin casting
   Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Photoresist coat (Shipley 3612)
1 Dehydration bake
on front
2 100% HMDS prime
MaterialHMDS
on front
3 Photoresist coat (Shipley 3612)
MaterialShipley 3612
4 Soft bake
5 Hard bake
Process characteristics:
Resist thickness
Thickness of material to be deposited.
Resist thickness*
Thickness of material to be deposited.
Material Shipley 3612
Wafer size
Wafer size
Comments:
  • The film is hardbaked at 110 C for 25 min.
  Contact us    Search    Comment on this page