Backside protect (AZ P4400): View

on front Backside protect (AZ P4400)

on back

Material	AZ P4400

Material	photoresist (category)

Process characteristics:

Resist thickness

1 .. 7 µm

Material

AZ P4400

Max field size

200 mm

Wafer diameter(s)

List or range of wafer diameters the tool can accept

75 .. 200 mm

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

glass (category), silicon, silicon on insulator

Wafer size

Comments:

Please select this module if the other side of the wafer needs to be protected during the front-to-back alignment step of a contact lithography module.