G-line BCB coat (BCB 4000): View

on front G-line BCB coat (BCB 4000)

Process characteristics:

Thickness

3 .. 20 µm

Materials

BCB 4024-40, BCB 3022-63, BCB 4026-46

Sides processed

either

Wafer size

Equipment

MTI BCB coater

Equipment characteristics:

Batch sizes

100 mm: 10, 125 mm: 10, 150 mm: 10

MOS clean

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat, notched, no-flat

Wafer holder

Device that holds the wafers during processing.

plastic chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon, sapphire, quartz (single crystal), silicon germanium, Foturan (Schott), quartz (fused silica), fused silica, ceramic, glass-ceramic, silicon on insulator, alumina, glass (Hoya), silicon on sapphire, Corning 1737, Borofloat (Schott), Pyrex (Corning 7740), silicon carbide

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 1100 µm

Comments:

Benzocyclobutene (BCB) -based polymer dielectrics
CYCLOTENE* Advanced Electronics Resins from The Dow Chemical Company are high-purity polymer solutions that have been developed for microelectronics applications. The resins are derived from B-staged bisbenzocyclobutene (BCB) monomers and are formulated as high-solids, low-viscosity solutions.
Notable properties of the resins include:
* Low dielectric constant
* Low loss at high frequency
* Low moisture absorption
* Low cure temperature
* High degree of planarization
* Low level of ionics
* High optical clarity
* Good thermal stability
* Excellent chemical resistance
* Good compatibility with various metallization systems
The resins are available in photosensitive and dry-etch grades.
See its properties at:
http://www.dow.com/cyclotene/over.htm