Resist bonding: View

Process Hierarchy

LPCVD

PECVD

on front Resist bonding

Batch size

Material

Arch OiR 897-10i

Sides processed

either

Thickness

1 .. 2 µm

Wafer size

Equipment

Equipment characteristics:

Wafer geometry

Types of wafers this equipment can accept

1-flat, no-flat

Wafer holder

Device that holds the wafers during processing.

teflon cassette

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

300 .. 600 µm