Photoresist coat with softbake (Shipley 1813): View

MEMS and Nanotechnology Exchange

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Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front Photoresist coat with softbake (Shipley 1813)

Material	HMDS	Thickness	1 nm

on front

2 Photoresist coat (Shipley 1813)

Material	Shipley 1813

3 Photoresist softbake (Shipley 1813)

Material	Shipley 1813

Process characteristics:

Resist thickness

1.3 .. 2.5 µm

Excluded materials

gold (category), copper

Material

Shipley 1813

Wafer size

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.