|
|
| Batch size |
25 |
|---|
| Excluded materials |
gold (category), copper |
|---|
| Material |
HMDS |
|---|
| Sides processed |
both |
|---|
| Thickness |
1 nm |
|---|
| Wafer size |
|
|---|
| Equipment |
Yield Engineering Systems YES-3 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
stainless steel |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon dioxide |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Extra terms |
Customer agrees that wafers, masks, and other materials
incorporating any process(es) provided by this fabrication site
are to be used solely for non-commercial research
purposes.
|
MEMS and Nanotechnology Exchange