Anisotropic etch: Page 1 of 5

MEMS and Nanotechnology Exchange

Wet and dry etch processes in which the undercutting is different from (in most case less than) the depth of the etch.

Process
Advanced silicon dioxide etch (AOE) with photolithography
Silicon DRIE with photolithography (Unaxis VLR 700)
Silicon DRIE with photolithography (PlasmaTherm 770)
Aluminum (1% silicon) plasma etch
Aluminum plasma etch
Deep RIE (Bosch process)
Deep RIE (Bosch process) with photolithography
Silicon dioxide plasma etch (anisotropic)
Silicon dioxide plasma etch (anisotropic, MOS clean)
Titanium plasma etch
Titanium/tungsten plasma etch
Tungsten plasma etch
Aluminum plasma etch
Polysilicon RIE
Silicon DRIE
Silicon DRIE with anti-footing SOI
Silicon dioxide plasma etch
Silicon nitride plasma etch
Silicon DRIE
Ion Milling

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