Isotropic etch: Page 1 of 4

MEMS and Nanotechnology Exchange

Wet and dry etch processes in which the undercutting is equal to the etch depth.

Process
HF release & Supercritical dry
Aluminum (1% silicon) wet etch
Post-implant photoresist strip (non-metal)
Post-plasma etch photoresist strip (metal)
Aluminum wet etch
HF etch
Phosphoric acid etch
Zinc Oxide wet etch
Aluminum wet etch
BOE Etch
Down Stream Plasma Ashing / Stripping
Down Stream Plasma Descum
Gold wet etch
HF 10:1 Batch Etch
HF Vapor Phase Etch
HF etch (10:1) Single Wafer
Nickel/Copper wet etch
Photoresist Descum (Metroline)
Photoresist Stripping (Metroline)
Photoresist wet strip (PRS 3000)
Results Page: 1 2 3 4