Aluminum wet etch: View

Aluminum wet etch

Process characteristics:

Depth

0.1 .. 5 µm

Batch sizes

100 mm: 25, 150 mm: 1

Etch type

wet isotropic

Etchant

Solutions and their concentrations.

phosphoric acid/nitric acid/acetic acid

Material

aluminum

Sides processed

both

Temperature

25 °C

Wafer size

Equipment

Wet bench

Equipment characteristics:

Piece geometry

Geometry of wafer pieces the equipment can accept

rectangular, circular

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

quartz (fused silica), silicon carbide, silicon on insulator, quartz (single crystal), sapphire, silicon, Pyrex (Corning 7740), gallium arsenide, indium phosphide

Wafer thickness

List or range of wafer thicknesses the tool can accept

250 .. 800 µm