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MNX

Strip: Page 1 of 2

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • Anisotropic etch
  • Deep RIE
  • Isotropic etch
  • Miscellaneous etch
  • Strip
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
Strip
Processes used to completely remove a layer of material. Most often used for photoresist removal after pattern transfer to substrate.
per page
Process
Photoresist Removal (for metallized wafers, no gold)
Down Stream Plasma Ashing / Stripping
Photoresist Descum (Metroline)
Photoresist Strip (Plasmalab)
Photoresist Stripping (Metroline)
Photoresist wet strip (PRS 3000)
Photoresist wet strip (acetone)
Silicon dioxide RIE (Plasmalab)
Silicon nitride RIE (PlasmaLab)
Photoresist strip (SU-8)
Photoresist ashing
Photoresist wet strip
Photoresist strip (O2 plasma)
Photoresist wet strip
Photoresist Strip
Photoresist ashing I (metal allowed)
Photoresist ashing II (metal allowed)
Photoresist strip
Photoresist strip (metal)
Photoresist strip (non-metal)
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