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Photoresist Removal (for metallized wafers, no gold): View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
   Anisotropic etch
   Deep RIE
   Isotropic etch
   Miscellaneous etch
   Strip
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

on front
Photoresist Removal (for metallized wafers, no gold)
Materialphotoresist (category)
on front
Photoresist ashing
Depth 0 .. 10 µm
Material photoresist (category)
Wafer size
Wafer size
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