on front Photoresist ashing |
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|
| Etchant Solutions and their concentrations. |
oxygen |
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| Sides processed |
either |
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| Temperature |
25 °C |
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| Wafer size |
|
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| Equipment |
Matrix 106 Resist Removal System |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
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| Wafer holder Device that holds the wafers during processing. |
cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
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