on front G-line BCB develop (BCB4000) |
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|
| Batch size |
10 |
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| Developer Agent that reacts with masking layer (e.g., photoresist) to etch it selectively. |
DS2100 |
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| Duration |
90 s |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
MTI BCB coater |
| Equipment characteristics: |
| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
plastic chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, sapphire, quartz (single crystal), silicon germanium, Foturan (Schott), quartz (fused silica), fused silica, ceramic, glass-ceramic, silicon on insulator, alumina, glass (Hoya), silicon on sapphire, Corning 1737, Borofloat (Schott), Pyrex (Corning 7740), silicon carbide |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1100 µm |
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