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| Process characteristics: |
| Aspect ratio Specify preferred aspect ratio (if known) of etch process. Aspect ratio is defined as (etch depth)/(undercut). |
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| Depth Depth to etch in material. |
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| Material Material to be etched. |
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| Minimum feature size (masked) The dimension of the smallest masked feature to be protected during the etch.
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| Minimum feature size (open) The dimension of the smallest unmasked (open) feature to be etched. |
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| Sides processed Specify whether etching is to occur on a single or both sides of substrate. |
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| Temperature Specify preferred process temperature (if known). |
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| Equipment |
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