on front Lift-off etch (1112A) |
|---|
|
| Batch size |
1 |
|---|
| Depth |
2.7 µm |
|---|
| Etchant Solutions and their concentrations. |
Shipley Remover 1112A |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Material |
Shipley 1827 |
|---|
| Min feature size |
5 µm |
|---|
| Sides processed |
either |
|---|
| Temperature |
80 °C |
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| Wafer size |
|
|---|
| Equipment |
Silicon organic wet bench |
| Equipment characteristics: |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
50 .. 1000 µm |
|---|
| Comments: |
|
MEMS and Nanotechnology Exchange