Process Hierarchy

on front
  5X DUV photolithography
  2 HMDS Prime
MaterialHMDS
MaterialShipley UV210
MaterialShipley UV210
on front
  6 DUV exposure
MaterialShipley UV210
MaterialShipley UV210
MaterialShipley UV210
MaterialShipley UV210
Process characteristics:
Perform hard bake
Perform hard bake*
yes no
Resist thickness
Resist thickness*
Batch size 12
Magnification 5
Material Shipley UV210
Max field size 21 mm
Min feature size 0.35 µm
Wafer size
Wafer size
Comments:
Attachments
asml_fiducials.gds (76.0 KB, application/octet-stream) [Browse]
attached by ozgur (Mehmet Ozgur) on 2004-01-06 16:21
Frame information