Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  DUV photoresist coat (Shipley UV210)
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer
Material Shipley UV210
Setup time 60 min
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment SVG 8800 Photoresist coat and develop track
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 800 µm