Process Hierarchy

on front
  DUV exposure
Focal depth
Depth of focus of a single objective at a single setting (include objective)
0.8 µm
Magnification 5
Material Shipley UV210
Max field size 21 µm
Setup time 30 min
Sides processed either
Wavelength
Wavelength of light used during the exposure
248 nm
Wafer size
Wafer size
Equipment ASML 5500/90 DUV 5X stepper
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm