Process Hierarchy

on front
  Wet oxidation
Process characteristics:
Perform clean
Perform clean*
yes no
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.1 .. 6 µm
0.1 .. 6 µm
Batch size 50
Excluded materials gold (category), copper
Material silicon dioxide
Sides processed both
Uniformity -0.02 .. 0.02
Wafer size
Wafer size
Extra terms