Process Hierarchy

  Piranha Clean
Solutions and their concentrations.
sulfuric acid/hydrogen peroxide
Sides processed both
Temperature 120 °C
Time 15 min
Wafer size
Wafer size
Equipment Wet bech #1
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), fused silica, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm
Extra terms